Contact Probes
SEIKEN has been developing the following technologies.
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Standard type
contact probes
We provide standard type contact probes to be used for testing printed circuit boards and electronic components. Our standard types are basically single ended probes and also be mounted into receptacles (housing unit) where an electrical connection is made.
Standard type contact probes -
Double plunger
Contact Probes
Double plunger contact probes are typically used for semiconductor testing and we offer various types to meet high level requirements.
Double plunger Contact Probes -
CNT (Carbon Nano Tube)
Technology
Carbon nanotube(CNT) is allotropes of carbon with a cylindrical structure and the size is about φ0.1μm x 20μm. We have developed our own CNT coating technologies and we will apply the technology to contact probes for power device testing in the future.
CNT(Carbon Nano Tube) Technology -
Non-magnetic
technology
We have developed highly non-magnetic contact probes to realize higher customs needs by improving processing technology and usage of new non-magnetic materials and surface treatment.
Non-magnetic technology -
Rare metal(minor metal)
joining technology
Rare metals (minor metals) are known for having superior properties. We have developed new contact probe with its tip material made of rare metals by using our unique technologies
Rare metal(minor metal) joining technology -
Kelvin technology
We provide support for Kelvin measurement to contact 2 points on one electrode by utilizing our own know-how and technologies. We make approached though our unique tip shape and processing in addition to ensuring space by simply tapering pins.
Kelvin technology -
Fine pitch technology
Recent growth of electrical devices and high density, fine pitch contact probes are required. We are always challenging and developing fine pitch contact probes by utilizing our processing technologies and skill.
Fine pitch technology -
Bias technology
Bias ball forces plunger into continuous contact with the barrel inner wall at all times and this has disadvantage such as decreased lifespan and pitch. We have developed new bias design technology.
Bias technology -
Lead-free technology
For lead-free bumps and solder balls, due to adherence of solder, the life of traditional probes is shortened and running cost is increased. Our product development is based on the lead-free solution to meet customer’s needs.
Lead-free technology -
High heat resistance technology
To ensure products reliability, thermal resistance test under high temperature is very essential. We will propose our best solution under high temperature.
High heat resistance technology
