Conventionally, depending on the purpose of test, the type of a probe card was clearly categorized into two groups, cantilever type for wafer testing process and vertical type for final testing process.
But nowadays, the semiconductor industry has stepped up with advances in process and technologies and the required performance varies depending on the deference use, a cantilever type probe card cannot support for the testing of WL-CSP, Flip Chip and Copper Pillar.
Ｐ＝８０ｕｍのピン配置
We are now challenging to develop a contact probes supporting the narrowest pitch of a vertical probe card. For more information, please contact at info@seiken.co.jp
