There are many different types of IC packages with each having it’s own advantage and disadvantage. BGA and CSP use the ball of solder in grid pattern as connections to PCB. QFP and SOP are characterized by gull-wiring type lead. QFN and SON are no-lead, instead the electrode pad is prepared as terminal for connection.
For test environment, we have secured various models that respond to our customer semiconductor package test. Also, for customized products for special purpose, we are able to provide full technical support. Above all, we have secured various pins based on Test Probe Pin manufacture technology and we can provide the best solution required by customer.
We handle everything from IC test sockets designing and pin board resin processing to assembling and inspection under an integrated in-house production system. For more information, please contact at info@seiken.co.jp
